STRESS-RELAXATION AND HILLOCK GROWTH IN THIN-FILMS

被引：68

作者：

JACKSON, MS ^{[1
]}

LI, CY ^{[1
]}

机构：

[1] CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853

来源：

ACTA METALLURGICA | 1982年 / 30卷 / 11期

关键词：

D O I：

10.1016/0001-6160(82)90103-1

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：1993 / 2000

页数：8

共 14 条

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[2] HILLOCK GROWTH IN THIN-FILMS
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[3] STRAIN-RELAXATION IN THIN-FILMS ON SUBSTRATES
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[J]. ACTA METALLURGICA, 1974, 22 (02): : 177 - 183
[4] DIFFUSION CREEP OF A THIN FOIL
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[5] GUPTA D, COMMUNICATION
[6] CONSTITUTIVE RELATIONS FOR NONELASTIC DEFORMATION OF METALS
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[J]. JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 1976, 98 (03): : 193 - 202
[7] HUANG FH, 1978, CHARACTERIZATIO MPC7, P83
[8] STRESS RELIEF AND HILLOCK FORMATION IN THIN LEAD FILMS
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[J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (07) : 3172 - &
[9] RESIDUAL STRAINS OF PB THIN-FILMS DEPOSITED ONTO SI SUBSTRATES
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[J]. ACTA METALLURGICA, 1978, 26 (01): : 175 - 183
[10] THERMAL STRAIN IN LEAD THIN-FILMS .4. EFFECTS OF MULTIPLE CYCLING TO 4.2-K
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[J]. THIN SOLID FILMS, 1979, 60 (01) : 1 - 9