THE INFLUENCE OF BIAS SPUTTERING AND WAFER PREHEATING ON THE STEP COVERAGE OF SPUTTERED ALUMINUM

被引：12

作者：

SMITH, JF

ZOLD, FT

CLASS, W

机构：

来源：

THIN SOLID FILMS | 1982年 / 96卷 / 04期

关键词：

D O I：

10.1016/0040-6090(82)90513-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：291 / 299

页数：9

共 8 条

[1]

Chapman B., 1980, GLOW DISCHARGE PROCE

[2] INFLUENCE OF BIAS ON DEPOSITION OF METALLIC-FILMS IN RF AND DC SPUTTERING [J].

CUOMO, JJ ;

GAMBINO, RJ ;

ROSENBER.R .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01) :34-40

[3] ANALYSIS OF SUBSTRATE HEAT FLUXES ENCOUNTERED DURING ALUMINUM MAGNETRON SPUTTER DEPOSITION [J].

HIERONYMI, R ;

SIROVICH, B ;

CLASS, W .

THIN SOLID FILMS, 1982, 96 (03) :241-247

[4] EVOLUTION AND CURRENT STATUS OF ALUMINUM METALLIZATION [J].

LEARN, AJ .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (06) :894-906

[5]

PATTEN JW, 1972, J APPL PHYS, V43, P4811, DOI 10.1063/1.1661020

[6] EFFECT OF TEXTURE AND GRAIN-STRUCTURE ON ELECTROMIGRATION IN AL-0.5-PERCENT CU THIN-FILMS [J].

VAIDYA, S ;

SINHA, AK .

THIN SOLID FILMS, 1981, 75 (03) :253-259

[7] PROCESSES FOR MULTILEVEL METALLIZATION [J].

VOSSEN, JL ;

SCHNABLE, GL ;

KERN, W .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01) :60-70

[8]

VOSSEN JL, 1971, J VAC SCI TECHNOL, V8, P512

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