EFFECTS OF COMPOSITION AND STRUCTURE ON ELECTROMIGRATION KINETICS IN ALUMINUM-ALLOY THIN-FILMS

被引：8

作者：

FELTON, LE ^{[1
]}

SCHWARZ, JA ^{[1
]}

PASCO, RW ^{[1
]}

NORBURY, DH ^{[1
]}

机构：

[1] SYRACUSE UNIV,DEPT CHEM ENGN & MAT SCI,SYRACUSE,NY 13210

来源：

JOURNAL OF APPLIED PHYSICS | 1985年 / 58卷 / 02期

关键词：

D O I：

10.1063/1.336189

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：723 / 727

页数：5

共 19 条

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[8]

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[9] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS [J].

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