DIBORIDE DIFFUSION-BARRIERS IN SILICON AND GAAS TECHNOLOGY

被引:25
作者
SHAPPIRIO, JR
FINNEGAN, JJ
LUX, RA
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1986年 / 4卷 / 06期
关键词
D O I
10.1116/1.583466
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1409 / 1415
页数:7
相关论文
共 22 条
[11]   DIFFUSION BARRIERS IN THIN-FILMS [J].
NICOLET, MA .
THIN SOLID FILMS, 1978, 52 (03) :415-443
[12]  
POATE JM, 1978, THIN FILMS INTERDIFF, P9
[13]   METALLURGICAL AND ELECTRICAL PROPERTIES OF ALLOYED NI-AU-GE FILMS ON N-TYPE GAAS [J].
ROBINSON, GY .
SOLID-STATE ELECTRONICS, 1975, 18 (04) :331-&
[14]  
SAXENA AN, 1984, SOLID STATE TECHNOL, V27, P93
[15]  
SEVERIN P, 1974, NBS SPECIAL PUBLICAT
[16]   TIB2 AND ZRB2 DIFFUSION-BARRIERS IN GAAS OHMIC CONTACT TECHNOLOGY [J].
SHAPPIRIO, J ;
FINNEGAN, J ;
LUX, R ;
FOX, D ;
KWIATKOWSKI, J ;
KATTELUS, H ;
NICOLET, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06) :2255-2258
[17]  
SHAPPIRIO JR, 1985, SOLID STATE TECHNOL, V28, P161
[18]  
SHAPPIRIO JR, 1985, UNPUB 1985 P MAT RES
[19]   REFRACTORY-METAL SILICIDES FOR VLSI APPLICATIONS [J].
SINHA, AK .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (03) :778-785
[20]  
SINHA AK, 1983, VLSI TECHNOLOGY, P373