CHARACTERIZATION OF POLYIMIDES USED IN HIGH-DENSITY INTERCONNECTS

被引：17

作者：

PECHT, M

WU, X

机构：

[1] CALCE Electronic Packaging Research Center, University of Maryland, College Park

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1994年 / 17卷 / 04期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1109/96.338734

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Each of the three different polyimide films used in General Electric and Texas Instrument high-density interconnects has been characterized in terms of its out-of-plane and in-plane coefficient of thermal expansion, glass transition temperature, storage modulus, loss factor, and stress-strain and creep behavior, as a function of temperature and, as appropriate, deformation rate. This paper discusses these factors and the failure mechanisms of Kapton(R) and ULTEM(R) films in tensile tests.

引用

页码：632 / 639

页数：8

共 15 条

[1]

Bessonov M. I., 1987, POLYIMIDES THERMALLY

[2] OUT-OF-PLANE THERMAL-EXPANSION COEFFICIENT OF BIPHENYLDIANHYDRIDE-PHENYLENEDIAMINE POLYIMIDE FILM [J].

CHEN, ST ;

WAGNER, HH .

JOURNAL OF ELECTRONIC MATERIALS, 1993, 22 (07) :797-799

[3]

CLAIR TL, 1990, POLYIMIDES, P59

[4]

Cole H. S., 1992, International Journal of Microcircuits and Electronic Packaging, V15, P205

[5]

Hergenrother, 1990, POLYIMIDES, P187

[6] RELAXATION MODULUS AND THERMAL-EXPANSION COEFFICIENT OF POLYIMIDE FILMS COATED ON SUBSTRATES [J].

JOU, JH ;

CHEN, LJ .

APPLIED PHYSICS LETTERS, 1991, 59 (01) :46-47

[7]

LI M, IN PRESS INT J MICRO

[8] TIME-TEMPERATURE SUPERPOSITION AND PHYSICAL AGING IN AMORPHOUS POLYMERS [J].

MATSUMOTO, DS .

POLYMER ENGINEERING AND SCIENCE, 1988, 28 (20) :1313-1317

[9]

Nielsen L. E., 1974, MECHANICAL PROPERTIE

[10]

POTTIGER MT, 1991, MATER RES SOC SYMP P, V227, P187, DOI 10.1557/PROC-227-187

← 1 2 →