CRACK HEALING BEHAVIOR OF HOT-PRESSED SILICON-NITRIDE DUE TO OXIDATION

被引：96

作者：

CHOI, SR ^{[1
]}

TIKARE, V ^{[1
]}

机构：

[1] NASA,LEWIS RES CTR,CLEVELAND,OH 44135

来源：

SCRIPTA METALLURGICA ET MATERIALIA | 1992年 / 26卷 / 08期

关键词：

D O I：

10.1016/0956-716X(92)90574-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

收藏

页码：1263 / 1268

页数：6

相关论文

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