CORRELATION BETWEEN THERMAL-RESISTANCE, CHANNEL TEMPERATURE, INFRARED THERMAL MAPS AND FAILURE MECHANISMS IN LOW-POWER MESFET DEVICES

被引：8

作者：

CANALI, C

CHIUSSI, F

DONZELLI, G

MAGISTRALI, F

ZANONI, E

机构：

[1] TELETTRA SPA,I-20059 VIMERCATE,ITALY

[2] UNIV BARI,DIPARTIMENTO ELETTROTECN & ELETTRON,I-70125 BARI,ITALY

来源：

MICROELECTRONICS AND RELIABILITY | 1989年 / 29卷 / 02期

关键词：

D O I：

10.1016/0026-2714(89)90556-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：117 / &

共 10 条

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[8] MEASUREMENT OF THERMAL-RESISTANCE USING ELECTRICAL METHODS [J].

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[9]

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[10]

1977, GP201 IR SCANN MSC A

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