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SIGNIFICANT FEATURES OF SOLDER CONNECTIONS TO GOLD-PLATED THIN-FILMS

被引：16
作者：
KELLER, HN
机构：
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1982年 / 5卷 / 04期
关键词：
D O I：
10.1109/TCHMT.1982.1135984
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：408 / 419
页数：12
相关论文
共 15 条
[1]  
BADER WG, 1969, WELDING RES S JUN, P551
[2]  
BADER WG, 1980, P PHYS MET MET JOIN, P257
[3]   PERFORMANCE OF NEW COPPER-BASED METALLIZATION SYSTEMS IN AN 85-DEGREES-C, 78-PERCENT RH, SO2 CONTAMINATED ENVIRONMENT [J].
FEINSTEIN, LG ;
SBAR, NL .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (02) :159-171
[4]  
FEKULA RG, 1979, 29TH P EL COMP C, P192
[5]   RECENT ADVANCES IN SOLDER BOND TECHNOLOGY FOR MICROELECTRONIC PACKAGING [J].
HALL, PM ;
MORABITO, JM .
THIN SOLID FILMS, 1980, 72 (03) :433-442
[6]   TEMPERATURE CYCLING OF HIC THIN-FILM SOLDER CONNECTIONS [J].
KELLER, HN .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (01) :132-139
[7]   SOLDERING EXTERNAL CONNECTIONS TO THIN-FILM SYSTEMS [J].
KELLER, HN ;
MORABITO, JM .
SURFACE AND INTERFACE ANALYSIS, 1981, 3 (01) :16-22
[8]   TEMPERATURE AGING OF EXTERNAL CONNECTIONS CONDENSATION SOLDERED TO TI-PD-AU THIN-FILMS [J].
KELLER, HN .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (02) :180-195
[9]   RELIABILITY OF CLIP-ON TERMINALS SOLDERED TO TA-TA2N-NICR-PD-AU THIN-FILMS [J].
KELLER, HN .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (03) :294-301
[10]  
LAMPE BT, 1976, WELD J, V55, pS330
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