THERMALLY INDUCED HILLOCK FORMATION IN AL-CU FILMS

[1] EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (04) : 1487 - &

[2] ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1972, 33 (04) : 845 - +

[3] CHAKRAVE.BK, 1967, J PHYS CHEM SOLIDS, V28, P2401, DOI 10.1016/0022-3697(67)90026-1

[4] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) : 197 - +

[5] COLBY JW, 1971, MAGIC IV COMPUTER PR

[6] DHEURLE F, 1968, T METALL SOC AIME, V242, P502

[7] GHANDI SK, 1983, VLSI FABRICATION PRI, P387

[8] GLEITER H, 1983, PHYS MET METALLOGR, P684

[9] GOLDINER MG, 1975, FIZ TVERD TELA+, V17, P1234

[10] HERMAN DS, 1971, J VAC SCI TECHNOL, V9, P515

[1] EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (04) : 1487 - &

[2] ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1972, 33 (04) : 845 - +

[3] CHAKRAVE.BK, 1967, J PHYS CHEM SOLIDS, V28, P2401, DOI 10.1016/0022-3697(67)90026-1

[4] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) : 197 - +

[5] COLBY JW, 1971, MAGIC IV COMPUTER PR

[6] DHEURLE F, 1968, T METALL SOC AIME, V242, P502

[7] GHANDI SK, 1983, VLSI FABRICATION PRI, P387

[8] GLEITER H, 1983, PHYS MET METALLOGR, P684

[9] GOLDINER MG, 1975, FIZ TVERD TELA+, V17, P1234

[10] HERMAN DS, 1971, J VAC SCI TECHNOL, V9, P515