High density plasma processing of diamond films on titanium: Residual stress and adhesion measurements

High density plasma processing of diamond films on titanium was carried out by microwave plasma chemical vapor deposition. The deposited films were characterized by Raman spectroscopy and thin film x-ray diffraction. We measure a residual compressive stress of 3.5+/-1.0 GPa which is lower than that obtained in previous studies. A measure of the film adherence to the titanium substrates was obtained by examining micro-Raman spectra near Brale C indentations. Using a model for biaxially stressed polycrystalline diamond films, it is determined that as much as 7.8 GPa can be sustained in the film before delamination occurs. Our experimental results are compared to earlier adhesion data of diamond on titanium. (C) 1995 American Institute of Physics.