MODIFICATION OF THE GRAIN-SIZE OF SPUTTERED COPPER WITH ADDITIONS OF OXYGEN, KRYPTON, SILVER OR YTTRIUM

被引:8
作者
MOSS, RW
MERZ, MD
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 06期
关键词
D O I
10.1116/1.572818
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
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页码:2694 / 2699
页数:6
相关论文
共 5 条
[1]   KRYPTON ENTRAPMENT IN PULSE-BIASED SPUTTER-DEPOSITED METALS [J].
BAYNE, MA ;
MOSS, RW ;
MCCLANAHAN, ED .
THIN SOLID FILMS, 1978, 54 (03) :327-336
[2]   COPPER-BASED MATERIALS FORMED BY HIGH-RATE SPUTTERING [J].
BUSCH, R ;
MCCLANAHAN, ED .
THIN SOLID FILMS, 1977, 47 (03) :291-306
[3]  
EVANS JH, 1984, 12TH P ASTM S EFF RA
[4]   TENSILE-STRENGTH AND WORK-HARDENING OF ULTRAFINE-GRAINED HIGH-PURITY COPPER [J].
MERZ, MD ;
DAHLGREN, SD .
JOURNAL OF APPLIED PHYSICS, 1975, 46 (08) :3235-3237
[5]   ROOM-TEMPERATURE RECRYSTALLIZATION IN THICK BIAS-SPUTTERED COPPER DEPOSITS [J].
PATTEN, JW ;
MCCLANAHAN, ED ;
JOHNSTON, JW .
JOURNAL OF APPLIED PHYSICS, 1971, 42 (11) :4371-+