DISTRIBUTIONS OF ACTIVATION-ENERGIES FOR ELECTROMIGRATION DAMAGE IN THIN-FILM ALUMINUM INTERCONNECTS

被引：5

作者：

SCHWARZ, JA

机构：

来源：

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D O I：

10.1063/1.338185

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：798 / 800

页数：3

共 14 条

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