HEAVY-ION MICROSCOPY OF SINGLE EVENT UPSETS IN CMOS SRAMS

被引:28
作者
METZGER, S
DREUTE, J
HEINRICH, W
ROCHER, H
FISCHER, BE
HARBOESORENSEN, R
ADAMS, L
机构
[1] GESELLS SCHWERIONENFORSCH MBH,D-64220 DARMSTADT,GERMANY
[2] ESA,ESTEC,2200 AG NOORDWIJK,NETHERLANDS
关键词
D O I
10.1109/23.299804
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The single event upset (SEU) imaging has been applied at the GSI heavy ion microprobe to determine the sensitivity of integrated circuits (IC) to heavy ion irradiation. This method offers the possibility to directly image those parts of an IC which are sensitive to ion-induced malfunctions. By a 3-dimensional simulation of charge collection across p-n-micro-junctions we can predict SEU cross-sections. For a MHS65162 2k x 8bit CMOS SRAM we found two regions per bit with different sensitivity and measured a total cross-section of (71 +/- 18)mum2 for a bitflip per cell and simulated 60mum2 with an argon beam of 1.4 MeV/nucl. (LET of 19.7 MeV/mg/cm2).
引用
收藏
页码:589 / 592
页数:4
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