THE PROPERTIES OF ALUMINUM THIN-FILMS SPUTTER DEPOSITED AT ELEVATED-TEMPERATURES

[1] AMAZAWA T, 1986, 18TH C SOL STAT DEV, P755

[2] PLANAR DEPOSITION OF ALUMINUM BY RF-DC SPUTTERING WITH RF BIAS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (06) : 1466 - 1472

[3] Kamoshida K., 1986, International Electron Devices Meeting 1986. Technical Digest (Cat. No.86CH2381-2), P70

[4] INFLUENCES OF DC BIAS ON ALUMINUM FILMS PREPARED WITH A HIGH-RATE MAGNETRON SPUTTERING CATHODE [J]. THIN SOLID FILMS, 1985, 129 (3-4) : 309 - 314

[5] PLANARIZATION OF GOLD AND ALUMINUM THIN-FILMS USING A PULSED LASER [J]. IEEE ELECTRON DEVICE LETTERS, 1986, 7 (01) : 1 - 4

[1] AMAZAWA T, 1986, 18TH C SOL STAT DEV, P755

[2] PLANAR DEPOSITION OF ALUMINUM BY RF-DC SPUTTERING WITH RF BIAS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (06) : 1466 - 1472

[3] Kamoshida K., 1986, International Electron Devices Meeting 1986. Technical Digest (Cat. No.86CH2381-2), P70

[4] INFLUENCES OF DC BIAS ON ALUMINUM FILMS PREPARED WITH A HIGH-RATE MAGNETRON SPUTTERING CATHODE [J]. THIN SOLID FILMS, 1985, 129 (3-4) : 309 - 314

[5] PLANARIZATION OF GOLD AND ALUMINUM THIN-FILMS USING A PULSED LASER [J]. IEEE ELECTRON DEVICE LETTERS, 1986, 7 (01) : 1 - 4