PLANAR DEPOSITION OF ALUMINUM BY RF-DC SPUTTERING WITH RF BIAS

被引：63

作者：

HOMMA, Y

TSUNEKAWA, S

机构：

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1985年 / 132卷 / 06期

关键词：

D O I：

10.1149/1.2114145

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1466 / 1472

页数：7

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