GOLD ALUMINUM INTERMETALLICS - BALL BOND SHEAR TESTING AND THIN-FILM REACTION COUPLES

被引：43

作者：

CLATTERBAUGH, GV

WEINER, JA

CHARLES, HK

机构：

[1] Johns Hopkins Univ, Applied Physics, Lab, Laurel, MD, USA, Johns Hopkins Univ, Applied Physics Lab, Laurel, MD, USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1984年 / 7卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1984.1136367

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：349 / 356

页数：8

共 10 条

[1]

CHARLES HK, 1984, UNPUB ASTM STP, V850

[2]

CHARLES HK, 1983, NOV P INT MICR S, P171

[3]

FRANCOMBE MH, 1967, THIN SOLID FILMS, V1, P353

[4]

KOLESNIK.DP, 1972, FIZ MET METALLOVED+, V34, P529

[5] GOLD-ALUMINUM THIN-FILM INTERACTIONS AND COMPOUND FORMATION [J].

MAJNI, G ;

NOBILI, C ;

OTTAVIANI, G ;

COSTATO, M ;

GALLI, E .

JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) :4047-4054

[6] INTERMETALLIC FORMATION IN GOLD-ALUMINUM SYSTEMS [J].

PHILOFSKY, E .

SOLID-STATE ELECTRONICS, 1970, 13 (10) :1391-+

[7]

SHIMADE W, 1976, NOV P INT C SOLD BRA, P127

[8] MEASUREMENT OF DIFFUSION-INDUCED STRAINS AT METAL BOND INTERFACES [J].

TAKEI, WJ ;

FRANCOMB.MH .

SOLID-STATE ELECTRONICS, 1968, 11 (02) :205-&

[9]

WEINER J, 1983, 33RD P IEEE EL COMP, P208

[10]

WHITE ML, 1981, 19TH ANN P REL PHYS, P43

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