MONTE-CARLO SIMULATION OF THIN-FILM DEPOSITION IN A RECTANGULAR GROOVE

被引:52
作者
COOKE, MJ [1 ]
HARRIS, G [1 ]
机构
[1] UNIV COLL SWANSEA,DEPT ELECT & ELECTR ENGN,SWANSEA SA2 8PP,W GLAM,WALES
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1989年 / 7卷 / 06期
关键词
D O I
10.1116/1.576339
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:3217 / 3221
页数:5
相关论文
共 6 条
[1]  
ADAMS AC, 1983, VLSI TECHNOLOGY, pCH3
[2]   OPTIMIZATION OF AL STEP COVERAGE THROUGH COMPUTER-SIMULATION AND SCANNING ELECTRON-MICROSCOPY [J].
BLECH, IA ;
FRASER, DB ;
HASZKO, SE .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (01) :13-19
[3]  
COOKE MJ, 1986, 2ND P INT C SIMULATI, P398
[4]   A GENERAL SIMULATOR FOR VLSI LITHOGRAPHY AND ETCHING PROCESSES .2. APPLICATION TO DEPOSITION AND ETCHING [J].
OLDHAM, WG ;
NEUREUTHER, AR ;
SUNG, C ;
REYNOLDS, JL ;
NANDGAONKAR, SN .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1980, 27 (08) :1455-1459
[5]   CALCULATION OF DEPOSITION RATES IN DIODE SPUTTERING SYSTEMS [J].
WESTWOOD, WD .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (01) :1-9
[6]   A THEORY OF PLASMA-ASSISTED CHEMICAL VAPOR TRANSPORT PROCESSES [J].
ZAROWIN, CB .
JOURNAL OF APPLIED PHYSICS, 1985, 57 (03) :929-942