MODELING OF THE ELECTROPLATING OF A THROUGH-HOLE WITH FLOW REVERSAL AND DOWNSTREAM COUNTERELECTRODE CONFIGURATIONS

Two process configurations of periodic flow reversal with two equistant counterelectrodes and of unidirectional flow counterelectrodes and of unidirectional flow using only a downstream counterelectrode are analyzed using a general model of through-hole elecroplating. Although plating rates greater than attained with an ohmic-limited process cannot be achieved with a flow reversal process, the flow required in the through-holes can be significantly reduced. The use of only a downstream counterelectrode can improve the uniformity of deposition and increase the plating rate over ohmic-limited plating under certain conditions.