MECHANICAL TESTING OF THIN METALLIC-FILMS

被引：15

作者：

GRIFFIN, AJ ^{[1
]}

BROTZEN, FR ^{[1
]}

DUNN, CF ^{[1
]}

机构：

[1] TEXAS INSTRUMENTS INC,HOUSTON,TX 77251

来源：

THIN SOLID FILMS | 1992年 / 220卷 / 1-2期

关键词：

10;

D O I：

10.1016/0040-6090(92)90583-W

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Mechanical properties of thin-film metallizations used as interconnects in VLSI devices can be studied by different techniques. The present investigation centers about mechanical testing of aluminum films of submicron dimensions. Free-standing films were subjected to bulge and uniaxial testing, while films adherent to the silicon substrate were tested in an apparatus that employed cantilever specimens. It measured the deflection as a function of a variable load. The results of these in situ tests can be compared with stress-strain curves of free-standing films of identical composition. Because of the very high sensitivity required of the equipment, various experimental problems tend to arise, which are discussed in detail.

引用

页码：265 / 270

页数：6

共 10 条

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[9]

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