FABRICATION OF 0.25-MU-M PATTERNS ON A MEMBRANE SUBSTRATE-BASED X-RAY ABSORBER

被引:7
作者
FUJINO, T [1 ]
HASHIMOTO, M [1 ]
YOSHIOKA, N [1 ]
MORIIZUMI, K [1 ]
SATOU, T [1 ]
MORIMOTO, H [1 ]
WATAKABE, Y [1 ]
机构
[1] MITSUBISHI ELECTR CO,CENT RES LAB,AMAGASAKI,HYOGO 661,JAPAN
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1991年 / 30卷 / 11B期
关键词
X-RAY MASK; ELECTRON BEAM LITHOGRAPHY; PROXIMITY EFFECT CORRECTION; DRY ETCHING; MEMBRANE HEATING; TRILAYER PROCESS;
D O I
10.1143/JJAP.30.3058
中图分类号
O59 [应用物理学];
学科分类号
摘要
X-ray mask fabrication techniques, which are used in X-ray lithography for 0.25-mu-m devices, are studied in this paper. Initially, the process latitude for both the single- and trilayer processes is discussed according to the simulation results. The bottom layer thickness in the trilayer process was optimized to reduce the influence of backscattered electrons, and a proximity effect correction was introduced for the 0.25-mu-m pattern fabrication. In order to suppress membrane heating, a reverse-side polyvinyl alcohol (PVA) coating method was developed. The temperature was monitored with a special thermometer, and the effectiveness of the PVA coating was examined.
引用
收藏
页码:3058 / 3064
页数:7
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