APPLICATION OF PLASMA-ETCHING TO VIA HOLE FABRICATION IN THICK GAAS SUBSTRATES

被引：18

作者：

GEISSBERGER, AE

CLAYTOR, PR

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 03期

关键词：

D O I：

10.1116/1.573333

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：863 / 866

页数：4

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