INTERMETALLIC AND VOID FORMATION IN GOLD WIREBONDS TO ALUMINUM FILMS

被引：18

作者：

MAIOCCO, L ^{[1
]}

SMYERS, D ^{[1
]}

KADIYALA, S ^{[1
]}

BAKER, I ^{[1
]}

机构：

[1] DARTMOUTH COLL,THAYER SCH ENGN,HANOVER,NH 03755

来源：

MATERIALS CHARACTERIZATION | 1990年 / 24卷 / 04期

关键词：

D O I：

10.1016/1044-5803(90)90039-M

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Gold ball bonds attached to either pure Al films or Al films with Cu and Si additions were annealed at temperatures in the range 77-277°C for periods of up to 3,000 h and then shear tested. The resulting fracture surfaces were observed to change progressively with time and temperature of annealing. The intermetallic phases and voids present after each annealing treatment were characterized by microscopic examination of the bond cross sections. Shear test results are discussed in terms of the observed microstructures. © 1990.

引用

页码：293 / 309

页数：17

共 15 条

[1] SHEAR MODE WIRE FAILURES IN PLASTIC-ENCAPSULATED TRANSISTORS [J].

BASSECHES, H ;

DALTROY, FA .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1978, 1 (02) :143-147

[2]

BLISH C, 1983, P IEEE REL PHYS S, P142

[3]

CLATTERBAUGH GV, 1984, P IEEE ELEC COMP C, P21

[4]

GERLING W, 1984, IEEE EL COMP C NEW O, P13

[5]

HARMAN G, 1984, SOLID STATE TECH MAY, P186

[6]

HO PS, 1977, ELECTRO THERMO TRANS

[7] EFFECT OF SURFACE CONTAMINATION ON THERMOCOMPRESSION BONDABILITY OF GOLD [J].

JELLISON, JL .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (03) :206-211

[8]

KASHIWABARA M, 1969, REV ELEC COMMUN LAB, V17, P1001

[9] INFLUENCE OF CU AS AN IMPURITY IN AL/TI AND AL/W THIN-FILM REACTIONS [J].

KRAFCSIK, I ;

GYULAI, J ;

PALMSTROM, CJ ;

MAYER, JW .

APPLIED PHYSICS LETTERS, 1983, 43 (11) :1015-1017

[10]

MAIOCCO L, IN PRESS CORRELATION

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