VOID FORMATION IN THIN-FILMS

被引:2
作者
ANDREW, R [1 ]
LLOYD, JR [1 ]
机构
[1] IBM CORP,E FISHKILL FACIL,HOPEWELL JUNCTION,NY 12533
关键词
D O I
10.1016/0040-6090(82)90180-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:L25 / L26
页数:2
相关论文
共 8 条
[1]   GRAIN COARSENING AND GAS-BUBBLES IN AGED GOLD-FILMS [J].
ANDREW, R .
THIN SOLID FILMS, 1975, 29 (01) :53-57
[2]   GRAIN COARSENING AND GAS-BUBBLES IN ANNEALED GOLD-FILMS [J].
ANDREW, R ;
KRASEVEC, V .
PHILOSOPHICAL MAGAZINE, 1975, 31 (06) :1295-1306
[3]  
ANDREW R, 1981, UNPUB
[4]   VOIDS IN THIN AS-DEPOSITED GOLD-FILMS PREPARED BY VAPOR-DEPOSITION [J].
LLOYD, JR ;
NAKAHARA, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01) :655-659
[5]   VOID GROWTH IN EARLY STAGES OF AGING AND ELECTROMIGRATION [J].
LLOYD, JR ;
NAKAHARA, S .
JOURNAL OF APPLIED PHYSICS, 1977, 48 (12) :5092-5095
[6]  
LLOYD JR, 1981, NOV P MRS M BOST
[8]   VOID GROWTH IN THIN SILVER FILMS [J].
SHARMA, SK ;
SPITZ, J .
THIN SOLID FILMS, 1980, 67 (01) :109-116