共 14 条
CRRES MICROELECTRONICS TEST PACKAGE (MEP)
被引:8
作者:
MULLEN, EG
RAY, KP
机构:
[1] PL/GPSP, Hanscom Air Force Base, Hanscom, MA
关键词:
D O I:
10.1109/23.212346
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
The Microelectronics Test Package (MEP) flown on board the Combined Release and Radiation Effects Satellite (CRRES) contained over 60 device types and approximately 400 total devices which were tested for both single event upset (SEU) and total dose (parametric degradation and annealing). A description of the experiment, the method of testing devices, and the structure of data acquisition are presented. Sample flight data are shown. These included SEUs from a GaAs 1 K RAM during the March 1991 solar flare, and a comparison between passive shielding and a specially designed spot shielding package.
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页码:228 / 232
页数:5
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