THERMAL-ANALYSIS OF A MULTI-CHIP PACKAGE DESIGN

被引：9

作者：

DARVEAUX, R

HWANG, LT

REISMAN, A

TURLIK, I

机构：

[1] N CAROLINA STATE UNIV,DEPT MAT SCI & ENGN,RALEIGH,NC 27695

[2] N CAROLINA STATE UNIV,DEPT ELECTR & COMP ENGN,RALEIGH,NC 27650

[3] BELL NO RES,RES TRIANGLE PK,NC 27709

来源：

关键词：

D O I：

10.1007/BF02657418

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：267 / 274

页数：8

共 20 条

[11]

NAYAK D, 1988, UNPUB IEEE T COMP HY

[12]

NEUGEBAUER CA, 1988, SOLID STATE TECH NOV, P93

[13] A CONDUCTION-COOLED MODULE FOR HIGH-PERFORMANCE LSI DEVICES [J].

OKTAY, S ;

KAMMERER, HC .

[14]

OKTAY S, 1969, IBM J RES DEV, P272

[15] THERMAL CONDUCTANCE OF INDIUM SOLDER JOINTS AT LOW-TEMPERATURES [J].

RADEBAUGH, R .

[16]

SCHAPER LW, 1983, CHMT, V6, P283

[17]

TURLIK I, 1988, IEEE COMP PACKAG WOR

[18]

YOVANOVICH MM, 1969, J SPACECRAFT JUL, P855

[19]

YOVANOVICH MM, 1976, RADIATIVE TRANSFER T, V49, P381

[20]

1979, THERMOPHYSICAL PROPE, V1