DEPOSITION RATE AND SUBSTRATE TEMPERATURE EFFECTS ON STRUCTURE AND PROPERTIES OF BULK-SPUTTERED OFHC CU AND CU-O.15ZR

被引：8

作者：

HECHT, RJ ^{[1
]}

MULLALY, JR ^{[1
]}

机构：

[1] PRATT & WHITNEY AIRCRAFT,FLORIDA RES & DEV CTR,W PALM BEACH,FL 33402

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1975年 / 12卷 / 04期

关键词：

D O I：

10.1116/1.568683

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：836 / 841

页数：6

共 13 条

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[5] RELATIONSHIP BETWEEN SPUTTER CLEANING PARAMETERS AND SURFACE CONTAMINANTS
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[6] KURDOCK JW, 1974, AFWLTR7428 AIR FORC
[7] MCCLANAHAN ED, 1973, CR134542 NASA REP
[8] Movchan B. A., 1969, Fizika Metallov i Metallovedenie, V28, P653
[9] MULLALY JR, 1974, CR134629 NASA REP
[10] ROOM-TEMPERATURE RECRYSTALLIZATION IN THICK BIAS-SPUTTERED COPPER DEPOSITS
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[J]. JOURNAL OF APPLIED PHYSICS, 1971, 42 (11) : 4371 - +