FORMATION KINETICS OF INTERMETALLIC COMPOUNDS IN CU/SN THIN-FILMS

被引：11

作者：

HALIMI, R ^{[1
]}

CHPILEVSKI, EM ^{[1
]}

GORBATCHEVSKI, DA ^{[1
]}

机构：

[1] VI LENIN STATE UNIV,DEPT SOLID STATE PHYS,MINSK,BELORUSSIA,USSR

来源：

THIN SOLID FILMS | 1987年 / 148卷 / 01期

关键词：

D O I：

10.1016/0040-6090(87)90125-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：109 / 119

页数：11

共 18 条

[1]

BAGLIN J, 1980, THIN FILM INTERFACES

[2] The complex structure of the copper-tin intermetallic compounds [J].

Bernal, JD .

NATURE, 1928, 122 :54-54

[3] EPSILON-PHASE IN CU-SN SYSTEM [J].

BROOKS, PL ;

GILLAM, E .

ACTA METALLURGICA, 1970, 18 (11) :1181-&

[4] KINETICS OF PHASE FORMATION IN AU-AL THIN-FILMS [J].

CAMPISANO, SU ;

FOTI, G ;

RIMINI, E ;

LAU, SS ;

MAYER, JW .

PHILOSOPHICAL MAGAZINE, 1975, 31 (04) :903-917

[5]

Carlsson O, 1932, Z KRISTALLOGR, V83, P308

[6]

CHPILEVSKI EM, 1984, FILMS MINCES PHYSIQU, P295

[7]

GANGULEE A, 1975, THIN SOLID FILMS, V25

[8] DIFFUSION PROBLEMS IN MICRO-ELECTRONIC PACKAGING [J].

HALL, PM ;

MORABITO, JM .

THIN SOLID FILMS, 1978, 53 (02) :175-182

[9]

Hansen M., 1958, J ELECTROCHEM SOC, DOI DOI 10.1149/1.2428700

[10] GRAIN-BOUNDARY ELECTROTRANSPORT OF LIQUID ZONES IN THIN METAL-FILMS [J].

HOWARD, JK .

JOURNAL OF APPLIED PHYSICS, 1975, 46 (05) :1910-1918

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