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TIN FORMED BY EVAPORATION AS A DIFFUSION BARRIER BETWEEN AL AND SI
被引:177
作者
:
TING, CY
论文数:
0
引用数:
0
h-index:
0
TING, CY
机构
:
来源
:
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY
|
1982年
/ 21卷
/ 01期
关键词
:
D O I
:
10.1116/1.571700
中图分类号
:
O59 [应用物理学];
学科分类号
:
摘要
:
引用
收藏
页码:14 / 18
页数:5
相关论文
共 18 条
[11]
DEPOSITION OF TI-N COMPOUNDS BY THERMIONICALLY ASSISTED TRIODE REACTIVE ION PLATING
[J].
MATTHEWS, A
论文数:
0
引用数:
0
h-index:
0
MATTHEWS, A
;
TEER, DG
论文数:
0
引用数:
0
h-index:
0
TEER, DG
.
THIN SOLID FILMS,
1980,
72
(03)
:541
-549
[12]
Nelson, 1969, P INT S HYBRID MICRO, P413
[13]
DIFFUSION BARRIERS IN THIN-FILMS
[J].
NICOLET, MA
论文数:
0
引用数:
0
h-index:
0
NICOLET, MA
.
THIN SOLID FILMS,
1978,
52
(03)
:415
-443
[14]
REACTIVELY SPUTTERED TIN COATINGS FOR TRIBOLOGICAL APPLICATIONS
[J].
RAMALINGAM, S
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h-index:
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RAMALINGAM, S
;
WINER, WO
论文数:
0
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0
h-index:
0
WINER, WO
.
THIN SOLID FILMS,
1980,
73
(02)
:267
-274
[15]
INVESTIGATION OF TITANIUM-NITRIDE LAYERS FOR SOLAR-CELL CONTACTS
[J].
VONSEEFELD, H
论文数:
0
引用数:
0
h-index:
0
VONSEEFELD, H
;
CHEUNG, NW
论文数:
0
引用数:
0
h-index:
0
CHEUNG, NW
;
MAENPAA, M
论文数:
0
引用数:
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h-index:
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MAENPAA, M
;
NICOLET, MA
论文数:
0
引用数:
0
h-index:
0
NICOLET, MA
.
IEEE TRANSACTIONS ON ELECTRON DEVICES,
1980,
27
(04)
:873
-876
[16]
HIGH-TEMPERATURE CONTACT STRUCTURES FOR SILICON SEMICONDUCTOR-DEVICES
[J].
WITTMER, M
论文数:
0
引用数:
0
h-index:
0
WITTMER, M
.
APPLIED PHYSICS LETTERS,
1980,
37
(06)
:540
-542
[17]
TIN AND TAN AS DIFFUSION-BARRIERS IN METALLIZATIONS TO SILICON SEMICONDUCTOR-DEVICES
[J].
WITTMER, M
论文数:
0
引用数:
0
h-index:
0
WITTMER, M
.
APPLIED PHYSICS LETTERS,
1980,
36
(06)
:456
-458
[18]
WITTMER M, J APPL PHYS
←
1
2
→
共 18 条
[11]
DEPOSITION OF TI-N COMPOUNDS BY THERMIONICALLY ASSISTED TRIODE REACTIVE ION PLATING
[J].
MATTHEWS, A
论文数:
0
引用数:
0
h-index:
0
MATTHEWS, A
;
TEER, DG
论文数:
0
引用数:
0
h-index:
0
TEER, DG
.
THIN SOLID FILMS,
1980,
72
(03)
:541
-549
[12]
Nelson, 1969, P INT S HYBRID MICRO, P413
[13]
DIFFUSION BARRIERS IN THIN-FILMS
[J].
NICOLET, MA
论文数:
0
引用数:
0
h-index:
0
NICOLET, MA
.
THIN SOLID FILMS,
1978,
52
(03)
:415
-443
[14]
REACTIVELY SPUTTERED TIN COATINGS FOR TRIBOLOGICAL APPLICATIONS
[J].
RAMALINGAM, S
论文数:
0
引用数:
0
h-index:
0
RAMALINGAM, S
;
WINER, WO
论文数:
0
引用数:
0
h-index:
0
WINER, WO
.
THIN SOLID FILMS,
1980,
73
(02)
:267
-274
[15]
INVESTIGATION OF TITANIUM-NITRIDE LAYERS FOR SOLAR-CELL CONTACTS
[J].
VONSEEFELD, H
论文数:
0
引用数:
0
h-index:
0
VONSEEFELD, H
;
CHEUNG, NW
论文数:
0
引用数:
0
h-index:
0
CHEUNG, NW
;
MAENPAA, M
论文数:
0
引用数:
0
h-index:
0
MAENPAA, M
;
NICOLET, MA
论文数:
0
引用数:
0
h-index:
0
NICOLET, MA
.
IEEE TRANSACTIONS ON ELECTRON DEVICES,
1980,
27
(04)
:873
-876
[16]
HIGH-TEMPERATURE CONTACT STRUCTURES FOR SILICON SEMICONDUCTOR-DEVICES
[J].
WITTMER, M
论文数:
0
引用数:
0
h-index:
0
WITTMER, M
.
APPLIED PHYSICS LETTERS,
1980,
37
(06)
:540
-542
[17]
TIN AND TAN AS DIFFUSION-BARRIERS IN METALLIZATIONS TO SILICON SEMICONDUCTOR-DEVICES
[J].
WITTMER, M
论文数:
0
引用数:
0
h-index:
0
WITTMER, M
.
APPLIED PHYSICS LETTERS,
1980,
36
(06)
:456
-458
[18]
WITTMER M, J APPL PHYS
←
1
2
→