ANISOTROPIC ETCHING OF SILICON USING AN SF6/AR MICROWAVE MULTIPOLAR PLASMA

被引:44
作者
POMOT, C
MAHI, B
PETIT, B
ARNAL, Y
PELLETIER, J
机构
[1] CNRS, Meylan, Fr, CNRS, Meylan, Fr
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1986年 / 4卷 / 01期
关键词
D O I
10.1116/1.583437
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
22
引用
收藏
页码:1 / 5
页数:5
相关论文
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