OXYGEN IN TITANIUM NITRIDE DIFFUSION-BARRIERS

被引：112

作者：

SINKE, W

FRIJILINK, GPA

SARIS, FW

机构：

来源：

APPLIED PHYSICS LETTERS | 1985年 / 47卷 / 05期

关键词：

D O I：

10.1063/1.96151

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

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页码：471 / 473

页数：3

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共 22 条

[1] CHARACTERIZATION OF TITANIUM NITRIDE FILMS DEPOSITED ONTO SILICON
ARMIGLIATO, A
CELOTTI, G
GARULLI, A
GUERRI, S
OSTOJA, P
ROSA, R
MARTINELLI, G
[J]. THIN SOLID FILMS, 1982, 92 (04) : 341 - 346
[2] TIN COATINGS ON STEEL
BUHL, R
PULKER, HK
MOLL, E
[J]. THIN SOLID FILMS, 1981, 80 (1-3) : 265 - 270
[3] THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS
CHEUNG, NW
VONSEEFELD, H
NICOLET, MA
HO, F
ILES, P
[J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) : 4297 - 4299
[4] CHEUNG NW, 1980, P S THIN FILM INTERF, V80, P323
[5] TITANIUM NITRIDE AS A DIFFUSION BARRIER BETWEEN NICKEL SILICIDE AND ALUMINUM
FINETTI, M
SUNI, I
NICOLET, MA
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1984, 13 (02) : 327 - 340
[6] TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM
GARCEAU, WJ
FOURNIER, PR
HERB, GK
[J]. THIN SOLID FILMS, 1979, 60 (02) : 237 - 247
[7] MICROSTRUCTURE AND HARDNESS OF TI(C,N) COATINGS ON STEEL PREPARED BY THE ACTIVATED REACTIVE EVAPORATION TECHNIQUE
JACOBSON, BE
DESHPANDEY, CV
DOERR, HJ
KARIM, AA
BUNSHAH, RF
[J]. THIN SOLID FILMS, 1984, 118 (03) : 285 - 292
[8] GROWTH AND PROPERTIES OF SINGLE-CRYSTAL TIN FILMS DEPOSITED BY REACTIVE MAGNETRON SPUTTERING
JOHANSSON, BO
SUNDGREN, JE
GREENE, JE
ROCKETT, A
BARNETT, SA
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (02): : 303 - 307
[9] INFLUENCE OF THE NITROGEN PARTIAL-PRESSURE ON THE PROPERTIES OF DC-SPUTTERED TITANIUM AND TITANIUM NITRIDE FILMS
LEMPERIERE, G
POITEVIN, JM
[J]. THIN SOLID FILMS, 1984, 111 (04) : 339 - 349
[10] CONTACT RESISTIVITIES OF SPUTTERED TIN AND TI-TIN METALLIZATIONS ON SOLAR-CELL-TYPE-SILICON
MAENPAA, M
NICOLET, MA
SUNI, I
COLGAN, EG
[J]. SOLAR ENERGY, 1981, 27 (04) : 283 - 287