ATOMISTIC MECHANISMS OF ADHESIVE CONTACT FORMATION AND INTERFACIAL PROCESSES

被引:123
作者
LANDMAN, U
LUEDTKE, WD
RINGER, EM
机构
[1] School of Physics, Georgia Institute of Technology, Atlanta
基金
美国国家科学基金会;
关键词
D O I
10.1016/0043-1648(92)90258-A
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Investigations were undertaken using large-scale molecular dynamics simulations of atomistic mechanisms of adhesive contact formation, friction, and wear processes. These processes occur as a result of interactions between material tips and substrate surfaces and reveal the energetics and dynamics of various wear phenomena. These include jump-to-contact, elastic, plastic and yield processes, connective neck formation, wetting, reconstruction, atomic-scale stick-slip, and materials transfer. Results are presented for several tip and substrate materials, including intermetallic (nickel and gold), interionic (CaF2), and thin alkane (n-hexadecane) films adsorbed on a metal (gold) surface and interacting with a metal (nickel) tip.
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页码:3 / 30
页数:28
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