SIGNIFICANT IMPROVEMENT IN STEP COVERAGE USING BIAS SPUTTERED ALUMINUM

[1] OPTIMIZATION OF AL STEP COVERAGE THROUGH COMPUTER-SIMULATION AND SCANNING ELECTRON-MICROSCOPY [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (01): : 13 - 19

[2] STEP COVERAGE SIMULATION AND MEASUREMENT IN A DC PLANAR MAGNETRON SPUTTERING SYSTEM [J]. JOURNAL OF APPLIED PHYSICS, 1983, 54 (06) : 3489 - 3496

[3] PLANAR DEPOSITION OF ALUMINUM BY RF-DC SPUTTERING WITH RF BIAS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (06) : 1466 - 1472

[4] HOMMA Y, 1983, 164TH P EL SOC M WAS, P438

[5] SMITH JF, 1984, SOLID STATE TECHNOL, V27, P135

[6] STUDY OF PLANARIZED SPUTTER-DEPOSITED SIO2 [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (03): : 1105 - 1112

[1] OPTIMIZATION OF AL STEP COVERAGE THROUGH COMPUTER-SIMULATION AND SCANNING ELECTRON-MICROSCOPY [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (01): : 13 - 19

[2] STEP COVERAGE SIMULATION AND MEASUREMENT IN A DC PLANAR MAGNETRON SPUTTERING SYSTEM [J]. JOURNAL OF APPLIED PHYSICS, 1983, 54 (06) : 3489 - 3496

[3] PLANAR DEPOSITION OF ALUMINUM BY RF-DC SPUTTERING WITH RF BIAS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (06) : 1466 - 1472

[4] HOMMA Y, 1983, 164TH P EL SOC M WAS, P438

[5] SMITH JF, 1984, SOLID STATE TECHNOL, V27, P135

[6] STUDY OF PLANARIZED SPUTTER-DEPOSITED SIO2 [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (03): : 1105 - 1112