SELF-AFFINE GROWTH OF COPPER ELECTRODEPOSITS

被引：42

作者：

IWASAKI, H

YOSHINOBU, T

机构：

[1] Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka 567, 8-1, Mihogaoka

来源：

PHYSICAL REVIEW B | 1993年 / 48卷 / 11期

关键词：

D O I：

10.1103/PhysRevB.48.8282

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We have studied the static surface roughness of 50-mum-thick copper electrodeposits on length scales between 5 and 10(4) nm using scanning tunneling and atomic force microscopy. The surface roughness depends strongly on the concentration of organic additives in the plating solution. Both the surface width and power spectra scale as a power of the system size. Self-affine surfaces became more fractal-like with decreased additives. The scaling exponent of the self-affine surface (1/2) is slightly larger than the simulation results for local growth models.

引用

页码：8282 / 8285

页数：4

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