ETCHING AND DEPOSITION PHENOMENA IN AN R.F. CH4 PLASMA

被引：14

作者：

MITURA, S

KLIMEK, L

HAS, Z

机构：

[1] Technical Univ of Lodz, Lodz, Pol, Technical Univ of Lodz, Lodz, Pol

来源：

THIN SOLID FILMS | 1987年 / 147卷 / 01期

关键词：

D O I：

10.1016/0040-6090(87)90043-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：83 / 92

页数：10

共 28 条

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