MICROSTRUCTURAL ANALYSIS AND TENSILE PROPERTIES OF THICK COPPER AND NICKEL SPUTTER DEPOSITS

被引：46

作者：

DAHLGREN, SD ^{[1
]}

NICHOLSON, WL ^{[1
]}

MERZ, MD ^{[1
]}

BOLLMANN, W ^{[1
]}

DEVLIN, JF ^{[1
]}

WANG, DR ^{[1
]}

机构：

[1] BATTELLE MEM INST,PACIF NW LABS,RICHLAND,WA 99352

来源：

THIN SOLID FILMS | 1977年 / 40卷 / JAN期

关键词：

D O I：

10.1016/0040-6090(77)90136-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：345 / 353

页数：9

共 11 条

[1] COLUMNAR GRAINS AND TWINS IN HIGH-PURITY SPUTTER-DEPOSITED COPPER [J].

DAHLGREN, SD .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (04) :832-836

[2] RAPID CALCULATIONAL TECHNIQUE FOR STACKING-FAULT PROBLEM [J].

DEVLIN, JF ;

BOLLMANN, W .

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1975, 27 (02) :K57-K60

[3] TWIN FAULT INTERACTIONS [J].

DEVLIN, JF .

PHYSICS LETTERS A, 1975, A 51 (03) :131-132

[4] TENSILE-STRENGTH AND WORK-HARDENING OF ULTRAFINE-GRAINED HIGH-PURITY COPPER [J].

MERZ, MD ;

DAHLGREN, SD .

JOURNAL OF APPLIED PHYSICS, 1975, 46 (08) :3235-3237

[5] ROOM-TEMPERATURE RECRYSTALLIZATION IN THICK BIAS-SPUTTERED COPPER DEPOSITS [J].

PATTEN, JW ;

MCCLANAHAN, ED ;

JOHNSTON, JW .

JOURNAL OF APPLIED PHYSICS, 1971, 42 (11) :4371-+

[6] INFLUENCE OF GRAIN-SIZE ON WORK-HARDENING OF FACE-CENTERED CUBIC POLYCRYSTALS [J].

THOMPSON, AW ;

BASKES, MI .

PHILOSOPHICAL MAGAZINE, 1973, 28 (02) :301-308

[7]

THOMPSON AW, 1973, METALL TRANS, V4, P1599

[8] DEPENDENCE OF POLYCRYSTAL WORK-HARDENING ON GRAIN-SIZE [J].

THOMPSON, AW ;

BASKES, MI ;

FLANAGAN, WF .

ACTA METALLURGICA, 1973, 21 (07) :1017-1028

[9]

UNDERWOOD EE, 1968, QUANTITATIVE MICROSC, P93

[10] OBSERVATION OF TWIN FAULTS IN SPUTTER-DEPOSITED HIGH-PURITY NICKEL [J].

WANG, R ;

DAHLGREN, SD .

JOURNAL OF MATERIALS SCIENCE, 1975, 10 (08) :1456-1458

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