SLIDE FILM DAMPING IN LATERALLY DRIVEN MICROSTRUCTURES

被引:52
作者
CHO, YH
KWAK, BM
PISANO, AP
HOWE, RT
机构
[1] UNIV CALIF BERKELEY, NSF UNIV IND COOPERAT RES CTR, BERKELEY SENSOR & ACTUATOR CTR, BERKELEY, CA 94720 USA
[2] UNIV CALIF BERKELEY, DEPT MECH ENGN, BERKELEY, CA 94720 USA
关键词
D O I
10.1016/0924-4247(94)85027-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Slide film damping occurs when two parallel plates are in relative tangential motion. Viscous energy dissipation in the fluid between the two plates becomes a representative damping mechanism in laterally driven microdevices. In this paper, we investigate the slide film damping both theoretically and experimentally. A new physical model has been proposed for the characterization of slide film damping. Dynamic characteristics of a fluid film have been described in terms of velocity profiles, damping mechanisms, and levels of viscous energy dissipation. Simplified analytical damping formulae have been developed for practical Q estimation. The theoretical Q compares well with the experimental Q. Data reported by previous investigators are also analyzed and compared with the Q value estimated in the present study. It is concluded that our theoretical model offers simple and reasonably good quantitative prediction of Q. Possible sources of error in the theoretical Q prediction are discussed. The effects of fluid-film thickness and microstructure geometry on Q are investigated, so that the results can be used in the damping design for laterally driven microtransducers.
引用
收藏
页码:31 / 39
页数:9
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