THE EFFECTS OF RAPID THERMAL ANNEALING ON THE PROPERTIES OF PLASMA-ENHANCED CHEMICALLY VAPOR-DEPOSITED SILICON-NITRIDE

被引:16
作者
BROWN, WD [1 ]
KHALIQ, MA [1 ]
机构
[1] MANKATO STATE UNIV,DEPT ELECT ENGN & ELECTR ENGN TECHNOL,MANKATO,MN 56001
关键词
D O I
10.1016/0040-6090(90)90501-4
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Plasma-enhanced chemically vapor-deposited silicon nitride films have been rapidly thermal annealed at temperatures from 400 to 800 °C. A correlation between physical and memory properties of the material and the loss of hydrogen has been observed. The progressive loss of hydrogen results in film densification and an increase in both refractive index and absorption edge. Memory performance of the films is degraded by annealing and appears to be dependent on the ratio of SiH to NH. Additionally, certain combinations of anneal time and temperature result in stabilization of the nitride. The film resistivity decreases with annealing and is indicative of an increase in silicon dangling bonds created by hydrogen loss. © 1990.
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页码:73 / 85
页数:13
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