METALLURGICAL BEHAVIOR OF GOLD-BASED OHMIC CONTACTS TO THE INP/INGAASP MATERIAL SYSTEM

被引：28

作者：

CAMLIBEL, I

CHIN, AK

ERMANIS, F

DIGIUSEPPE, MA

LOURENCO, JA

BONNER, WA

机构：

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1982年 / 129卷 / 11期

关键词：

D O I：

10.1149/1.2123615

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

收藏

页码：2585 / 2590

页数：6

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