DRY ETCHING OF VIA CONNECTIONS FOR GAAS MONOLITHIC MICROWAVE INTEGRATED-CIRCUITS FABRICATION

被引：48

作者：

SALIMIAN, S

COOPER, CB

DAY, ME

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1987年 / 5卷 / 06期

关键词：

D O I：

10.1116/1.583636

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1606 / 1610

页数：5

共 6 条

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IBBOTSON, DE .

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GEISSBERGER, AE ;

CLAYTOR, PR .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03) :863-866

[5] DRY ETCHING OF THROUGH SUBSTRATE VIA HOLES FOR GAAS MMICS [J].

HIPWOOD, LG ;

WOOD, PN .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1985, 3 (01) :395-397

[6]

MOGAB CJ, 1977, J ELECTROCHEM SOC, V124, P1281