TRANSMISSION ELECTRON-MICROSCOPY OF GOLD-SILICON INTERACTIONS ON THE BACKSIDE OF SILICON-WAFERS

被引：38

作者：

CHANG, PH ^{[1
]}

BERMAN, G ^{[1
]}

SHEN, CC ^{[1
]}

机构：

[1] TEXAS INSTRUMENTS INC,MIL PROD,DALLAS,TX 75265

来源：

关键词：

D O I：

10.1063/1.339928

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1473 / 1477

页数：5

共 11 条

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