DIELECTRIC-BREAKDOWN PROPERTIES AND IV CHARACTERISTICS OF THIN SIO2-FILMS FORMED BY HIGH DOSE OXYGEN ION-IMPLANTATION INTO SILICON

被引:19
作者
DYLEWSKI, J [1 ]
JOSHI, MC [1 ]
机构
[1] UNIV BOMBAY, DEPT PHYS, BOMBAY 400019, INDIA
关键词
D O I
10.1016/0040-6090(77)90421-7
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:227 / 235
页数:9
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