SOLDER CONNECTIONS WITH A NI BARRIER

被引：26

作者：

KELLER, HN

机构：

[1] AT&T Bell Lab, Allentown, PA,, USA, AT&T Bell Lab, Allentown, PA, USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1986年 / 9卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1986.1136673

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：433 / 439

页数：7

共 8 条

[1]

BADER WG, 1969, WELDING RES S JUN, P551

[2]

BRITTON SC, 1974, T IMF, V0052, P00095, DOI DOI 10.1080/00202967.1974.11870313

[3]

DIBARI GA, 1983, PLATING SURFACE FINI, V70, P24

[4]

FEINSTEIN LG, 1977, IEEE T COMPONENTS HY, V13, P208

KELLER, HN .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (04) :408-419

MORABITO, JM ;

THOMAS, JH ;

LESH, NG .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (04) :253-262

[7]

Olsen D., 1975, 13th Annual Proceedings of Reliability Physics Symposium, P80, DOI 10.1109/IRPS.1975.362679

[8]

WASSINK RJK, 1984, SOLDERING ELECTRONIC, P99