Silicon carbide (SiC) thin films were deposited on titanium carbide (TiC) substrates by pyrolysis of 1,3 disilacyclobutane (C2H8Si2), at atmospheric pressure, in an inverted-vertical cold-wall chemical vapor deposition reactor. The growth rate, morphology, and crystallinity of the films were studied, at constant C2H8Si2 flow rate, as a function of substrate temperature (810-degrees-C less-than-or-equal-to T(s) less-than-or-equal-to 1285-degrees-C). The growth rate increased with increasing T(s). Film morphologies were dependent on T(s) and slight differences in TiC substrate orientation at T(s) greater-than-or-equal-to 1015-degrees-C. A smooth, soft as-grown morphology was obtained at 810-degrees-C. Hard, rough as-grown surfaces were obtained at T(s) greater-than-or-equal-to 1066-degrees-C. Films grown at T(s) greater-than-or-equal-to 1066-degrees-C contained a SiC primary phase and a Si-rich second phase. Epitaxial growth of beta-SiC was obtained only at 1210-degrees-C.