SHALLOW SOURCE-DRAIN STRUCTURES FOR VLSI CMOS TECHNOLOGY

被引:2
作者
BUTLER, AL
FOSTER, DJ
机构
来源
PHYSICA B & C | 1985年 / 129卷 / 1-3期
关键词
D O I
10.1016/0378-4363(85)90582-0
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
引用
收藏
页码:265 / 268
页数:4
相关论文
共 5 条
[1]   RESIDUAL DEFECTS FOLLOWING RAPID THERMAL ANNEALING OF SHALLOW BORON AND BORON FLUORIDE IMPLANTS INTO PREAMORPHIZED SILICON [J].
CARTER, C ;
MASZARA, W ;
SADANA, DK ;
ROZGONYI, GA ;
LIU, J ;
WORTMAN, J .
APPLIED PHYSICS LETTERS, 1984, 44 (04) :459-461
[2]   CHANNELING EFFECT OF LOW-ENERGY BORON IMPLANT IN (100) SILICON [J].
LIU, TM ;
OLDHAM, WG .
IEEE ELECTRON DEVICE LETTERS, 1983, 4 (03) :59-62
[3]   RECRYSTALLIZATION OF IMPLANTED AMORPHOUS SILICON LAYERS .1. ELECTRICAL-PROPERTIES OF SILICON IMPLANTED WITH BF2+ OR SI++B+ [J].
TSAI, MY ;
STREETMAN, BG .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (01) :183-187
[4]  
TSAUR BY, 1983, OCT ECS M, V83, P496
[5]   REDISTRIBUTION OF IMPLANTED DOPANTS AFTER METAL-SILICIDE FORMATION [J].
WITTMER, M ;
SEIDEL, TE .
JOURNAL OF APPLIED PHYSICS, 1978, 49 (12) :5827-5834