NEW PHENOMENA OF CHARGE DAMAGE IN PLASMA-ETCHING - HEAVY DAMAGE ONLY THROUGH DENSE-LINE ANTENNA

被引:134
作者
HASHIMOTO, K
机构
[1] LSI Wafer Process Division, Fujitsu Ltd, Nakahara-ku, Kawasaki, 211
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1993年 / 32卷 / 12B期
关键词
CHARGE DAMAGE; ANTENNA EFFECT; ANTENNA SHAPE; ECR PLASMA ETCHING; NONUNIFORMITY; MICROLOADING EFFECT; DAMAGE MECHANISM; ELECTRON SHADING;
D O I
10.1143/JJAP.32.6109
中图分类号
O59 [应用物理学];
学科分类号
摘要
The effect of antenna shape on charge damage has been examined using electron cyclotron resonance (ECR) plasma metal etching and test devices with an 8-nm-thick gate oxide. A dense-line antenna causes capacitor breakdown and the positive shift of the transistor's threshold voltage (V(t)), while a sparse-line antenna does not. This positive V(t) shift corresponds to a positive charge-up of the dense line, and is not dependent on overetching. Such damage is hardly observed when the antenna's top surface is exposed to the plasma, indicating that the plasma is uniform in terms of conventional charge damage. These new phenomena can be explained by a new mechanism consisting of electron shading with photoresist patterns. This shading leads to less neutralization of the ion charge impinging onto the transitory metal which remains between the antenna lines because of the microloading effect, and thus the excess positive charge causes the damage.
引用
收藏
页码:6109 / 6113
页数:5
相关论文
共 10 条
[1]  
Fang S, 1992, IEDM, P61
[2]   CHARGING DAMAGE TO GATE OXIDES IN AN O-2 MAGNETRON PLASMA [J].
FANG, SC ;
MCVITTIE, JP .
JOURNAL OF APPLIED PHYSICS, 1992, 72 (10) :4865-4872
[3]  
HASHIMOTO K, 1991, 13TH P S DRY PROC TO, P93
[4]  
KAWAMOTO Y, 1985, 7TH P S DRY PROC, P132
[5]  
Kubota M., 1991, International Electron Devices Meeting 1991. Technical Digest (Cat. No.91CH3075-9), P891, DOI 10.1109/IEDM.1991.235282
[6]   EXPERIMENTAL AND THEORETICAL-STUDY OF THE CHARGE BUILDUP IN AN ECR ETCHER [J].
NAMURA, T ;
OKADA, H ;
NAITOH, Y ;
TODOKORO, Y ;
INOUE, M .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1990, 29 (10) :2251-2254
[7]  
SAMUKAWA S, 1991, JPN J APPL PHYS TOKY, P199
[8]  
SEKINE M, 1991, P DRY PROCESS S, P99
[9]   THIN OXIDE CHARGING CURRENT DURING PLASMA-ETCHING OF ALUMINUM [J].
SHIN, H ;
KING, CC ;
HORIUCHI, T ;
HU, CM .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (08) :404-406
[10]  
Tsunokuni K., 1987, 19TH C SOL STAT DEV, P195