共 13 条
[2]
DALLY JW, 1990, PACKAGING ELECTRONIC, P382
[3]
DIETER GE, 1976, MECHANICAL METALLURG, P403
[4]
STRESSES AND DEFORMATION PROCESSES IN THIN-FILMS ON SUBSTRATES
[J].
CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES,
1988, 14 (03)
:225-268
[5]
Fuchs HO., 1980, METAL FATIGUE ENG, V103, P346
[6]
HARDRATH HF, 1953, 3017 NAT ADV CO AER
[7]
Hoffman R. W., 1966, PHYS THIN FILMS, VVol. 3, pp. 211
[8]
MANDEL CE, 1989, ELECTRONIC MATERIALS, V1, P876
[9]
Manson SS, 1965, EXP MECH, V5, P193, DOI DOI 10.1007/BF02321056