DEPENDENCE OF HARDNESS ON MODULATION AMPLITUDE IN ELECTRODEPOSITED CU-NI COMPOSITIONALLY MODULATED THIN-FILMS

被引：34

作者：

OBERLE, RR

CAMMARATA, RC

机构：

[1] Department of Materials Science, Engineering The Johns Hopkins University Baltimore

来源：

SCRIPTA METALLURGICA ET MATERIALIA | 1995年 / 32卷 / 04期

关键词：

D O I：

10.1016/0956-716X(95)90841-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：583 / 588

页数：6

共 21 条

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