A COMPARISON BETWEEN ALUMINUM AND COPPER INTERACTIONS WITH HIGH-TEMPERATURE OXIDE AND NITRIDE DIFFUSION-BARRIERS

被引：32

作者：

CHARAI, A ^{[1
]}

HORNSTROM, SE ^{[1
]}

THOMAS, O ^{[1
]}

FRYER, PM ^{[1
]}

HARPER, JME ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1989年 / 7卷 / 03期

关键词：

D O I：

10.1116/1.575840

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：784 / 789

页数：6

共 18 条

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