MICROSTRUCTURE OF RUO2 LAYER AS DIFFUSION BARRIER BETWEEN AL AND SI SUBSTRATE

被引：19

作者：

NIEH, CW

KOLAWA, E

SO, FCT

NICOLET, MA

机构：

来源：

MATERIALS LETTERS | 1988年 / 6卷 / 5-6期

关键词：

D O I：

10.1016/0167-577X(88)90096-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：177 / 180

页数：4

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