CHARACTERIZATION OF REACTIVELY SPUTTERED RUTHENIUM DIOXIDE FOR VERY LARGE-SCALE INTEGRATED METALLIZATION

被引:135
作者
KRUSINELBAUM, L
WITTMER, M
YEE, DS
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D O I
10.1063/1.97673
中图分类号
O59 [应用物理学];
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页码:1879 / 1881
页数:3
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共 17 条
[1]   OPTICAL ABSORPTION STUDY OF REDUCTION KINETICS OF RUTILE CRYSTALS [J].
CARNAHAN, RD ;
BRITTAIN, JO .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1965, 48 (07) :365-&
[2]   DIFFUSION OF COPPER IN THIN TIN FILMS [J].
CHAMBERLAIN, MB .
THIN SOLID FILMS, 1982, 91 (02) :155-162
[3]  
Gjostein N. A., 1973, DIFFUSION, P241
[4]   CHEMICAL VAPOR-DEPOSITION OF RUTHENIUM AND RUTHENIUM DIOXIDE FILMS [J].
GREEN, ML ;
GROSS, ME ;
PAPA, LE ;
SCHNOES, KJ ;
BRASEN, D .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (11) :2677-2685
[5]   INSITU FORMATION OF DIFFUSION BARRIERS IN THIN-FILM METALLIZATION SYSTEMS [J].
HOLLOWAY, PH ;
NELSON, CC .
THIN SOLID FILMS, 1976, 35 (01) :L13-L16
[6]  
Kofstad P., 1972, NONSTOICHIOMETRY ELE
[7]   ZRN DIFFUSION BARRIER IN ALUMINUM METALLIZATION SCHEMES [J].
KRUSINELBAUM, L ;
WITTMER, M ;
TING, CY ;
CUOMO, JJ .
THIN SOLID FILMS, 1983, 104 (1-2) :81-87
[8]   EFFECTS OF DEPOSITION METHODS ON THE TEMPERATURE-DEPENDENT RESISTIVITY OF TUNGSTEN FILMS [J].
KRUSINELBAUM, L ;
AHN, K ;
SOUK, JH ;
TING, CY ;
NESBIT, LA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06) :3106-3110
[9]  
KRUSINELBAUM L, 1986, MATER ISSUES INTEGRA, V71, P351
[10]  
RAO CN, 1974, NSRDSNBS49 NBS REP